RAAK PRO HITEX

The HITEX project will investigate the structure of the textile grid, the way in which smart materials can be processed on and in the textile grid and methods for producing digital textiles. In addition, there are also bottlenecks in the production chain that do not make this technological application of embedded electronics in textiles easy. System integration is of great importance precisely because of the many production steps and the complexity of integrating new materials and processes to traditional methods.

Genuine, widely used embedded electronics require integration across the entire chain. This means that all chain parties must come together to get results. To integrate electronics into textiles, every production step, from raw material to ready-to-wear, must be involved. With this consortium we have therefore composed a group with companies from every stage of production. 

Project goal

Within the Ambient Intelligence research group, our focus is to research technologies for the integration of electronics into textiles, the use of IoT technologies and embedded systems to enable smart applications using textile materials as a soft carrier. Some of the research topics that will be covered are in the areas of IoT wireless technologies, embedded software, portable devices, power optimization, printing electronics or textile electronics integration.

Topics

Soft electronics, smart textiles, textile electronic integration, IoT, embedded systems

Partners

This project is being developed in close collaboration with several industrial partners and coordinated by the Sustainable Functional Textiles (SFT) research group at Saxion University of Applied Sciences, for more information visit www.saxion.edu/sft.

Duration

The duration is 4 years, running from October 2019 until October 2023.

More information